Schneider Electric, a leader in the digital transformation of energy management and automation, today unveiled its world-leading portfolio of end-to-end liquid cooling solutions for hyperscale, colocation and high-density data centre environments, designed to build the AI factories of the future.
Available worldwide, Motivair cooling solutions from Schneider Electric reliably meet the power and GPU requirements of high-density data centres at scale.
The complete liquid and air cooling portfolio covers physical data centre infrastructure, including CDU, RDHx, HDU, dynamic cold plates, chillers and more, alongside software and services. All are designed to meet the thermal management requirements of next-generation high-performance computing (HPC), AI and accelerated computing workloads.
This announcement provides the first comprehensive overview of Schneider Electric's full liquid cooling capabilities since its acquisition of a controlling stake in Motivair in February 2025. As the industry reaches densities of 140 kW per rack, with future power densities of 1 MW and above, AI chips are becoming hotter and more densely packed.
Data centres need liquid cooling to efficiently cool heat-intensive workloads and keep critical infrastructure operating with maximum uptime and efficiency. Cooling can account for up to 40% of a data centre's electricity budget.
