The global exhibition focused on data centre technologies and infrastructure highlights LG’s end-to-end cooling portfolio for AI data centres (AIDC), underscoring its capabilities as a provider of integrated cooling solutions. A complete range of Direct-to-Chip cooling systems for AI workloads.
At DCW 2026, LG is presenting a range of Direct-to-Chip (DTC) cooling systems for data centres that use liquid cooling technologies to meet demanding heat density and capacity requirements. Its cold plate features a finned structure to optimise coolant flow and help manage heat from high-performance chips.
The 1,4 MW coolant distribution unit (CDU) combines a compact design with LG’s control and sensing technologies, delivering stable operation and improved energy efficiency through inverter-driven pumps.
Also on display are LG’s computer room air handling (CRAH) unit, featuring high-efficiency EC fans and motors, and an air-cooled centrifugal chiller (ACC), extending coverage from server-level cooling to overall facility infrastructure.
LG is expanding its portfolio with immersion cooling solutions through collaboration that addresses the growing cooling demands of high-density AI environments.
