This marks LG’s debut at DCW, where the company is showcasing a range of advanced data centre cooling solutions, including high-performance chillers, air- and liquid-based server cooling products, and the LG Building Energy Control (BECON) solution.
With highly efficient direct-to-chip (D2C) cooling technologies and integrated AI-based control software, LG aims to make significant inroads into North America’s rapidly growing data centre market.
AI data centres generate more heat and consume more electricity than conventional data centres due to higher server rack densities and greater use of resource-intensive computing chips, such as GPUs and high-bandwidth memory.
LG’s hybrid solution, which combines chip cooling and room cooling, is designed to meet the thermal management needs of these next-generation facilities, delivering outstanding performance and top-level energy efficiency.
Visitors to LG’s stand at DCW can learn about the company’s tailored cooling solutions for AI data centres and see the commitment to innovation that has placed LG at the forefront of the global HVAC industry.
